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 Featured Product:
DDR3 Project X
Project X: The World’s Most Advanced DDR3
Project X represents the most advanced DDR3 memory available. It is developed in Super Talent’s Silicon Valley Engineering Labs to deliver the highest attainable DDR3 memory performance. Project X memory combines blistering fast clock speeds with aggressively tuned latencies.
Project X employs an extreme cooling solution that offers double the surface area and 106% more aluminum mass than standard heat spreaders. With Super Talent’s special thermal adhesive, this cooling solution provides superior heat dissipation that results in a cooler, faster memory device.
Best of all, Project X memory was developed in partnership with Intel and leading motherboard vendors to support the new Xtreme Memory Profiles (XMP). XMP utilizes a reserved sector of the Serial Presence Detect (SPD) on memory modules to store factory configured profiles of memory timing settings. These profiles make it much easier to overclock memory and squeeze incremental performance from the PC. XMP replaces the pain of tweaking every individual memory parameter with the simplicity of selecting a single performance profile to optimize memory timings. XMP was designed exclusively for Intel P35 and X38 DDR3-based motherboards.
Project X memory is designed, built and tested in Super Talent’s San Jose, California headquarters, and is backed with a lifetime warranty. These two Project X Kits are built with the fastest available, carefully screened DRAM chips, and are hand tested as a matched pair on a dual channel Asus P5K3 Deluxe motherboard.
| Part Number |
Description |
W1800UX2GP |
DDR3-1800 2GB Kit (2x 1GB) 7-7-7-21 2.0V XMP |
W1600UX2GP |
DDR3-1600 2GB Kit (2x 1GB) 7-6-6-18 1.8V XMP |
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 Company News
Super Talent a Big Hit at Intel Developer Forum
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Italy’s Largest IT Convention Welcomes Super Talent
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The SMAU convention in Milan, Italy will be the site of our next Super Talent exhibit. Our full product range will be on display in the Super Talent booth.
Milan, Italy
Fiera Milano, Pavillion 22, Stand R-17
October 17-20, 2007 |
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